Dell and HPE Towers & Workstations

Workstations & Towers are meant to go above and beyond the capability of the regular PC. Graphics, memory capacity, and multitasking capabilities are greatly enhanced in the configuration of a workstation or tower. Many professions that utilize engineering, animation, rendering of graphics, and mathematical plotting benefit greatly from a powerful workstation or tower.

Shop Now

Filters

Price Range

Min ($)

Max ($)

$0$10,000+

Brand

Dell Technologies

HPE

Memory14

16 DDR4 DIMM slots (10 on CPU1, 6 on CPU2), supports RDIMM/LRDIMM, ECC only, speeds up to 2666MT/s, 1TB max (768GB recommended for performance-optimized configurations)116 DIMM slots with an 8-channel memory architecture, up to 4TB DDR5 with all slots populated, registered ECC124 DIMM slots (12 per processor, 6 memory channels per processor, 2 DIMMs per channel); HPE DDR4 SmartMemory; up to 2666 MT/s with 1st Generation processors or 2933 MT/s with 2nd Generation; up to 3TB using 24x 128GB LRDIMMs; RDIMM and LRDIMM cannot be mixed132 DDR5 DIMM slots (16 per processor, 8-channel architecture per processor), registered ECC DDR5 only, up to 8TB RDIMM, speeds up to 5600 MT/s. Note: memory runs at up to 4800 MT/s when all 32 slots are populated at 2 DIMMs per channel; minimum supported configuration is 16GB in a single slot132 DIMM slots (16 per processor, 8 memory channels per processor, 2 DIMMs per channel); HPE DDR5 Smart Memory up to 8TB total, speeds up to 6400 MT/s; RAS features include Advanced ECC, online spare and memory lock-step modes1

Networking3

1x 1GbE RJ-45 and 1x 10GbE RJ-45 on the rear panel; optional additional network controllers1Dual 1GbE standard, with 10GbE and 25GbE options via OCP 3.0 card configurations; dedicated iDRAC9 management network connector1Embedded 4x 1GbE NIC, with a broad range of additional networking options1

Form Factor7

2U rack workstation14U tower with optional rackable chassis conversion14U tower with optional tower-to-rack conversion kit (P47394-B21); occupies 5U when deployed as a rack model14U tower with rack conversion capability; occupies 5U when rack mounted15U rackable tower server1

Acoustics1

Optimized cooling across 10-35°C ambient range with lowest fan speeds; reference: 60dBA = conversation level, 45dBA = whispering/open office, 35dBA = quiet office1

Additional Storage1

Up to 8x M.2 NVMe PCIe SSDs via Dell Ultra-Speed Drive PCIe cards1

Certifications3

ISV certified for popular professional applications2ISV certified, EPEAT Gold registered, Reliable Memory Technology Pro, VR and AI ready1ISV certified; VR and AI ready1

More technical filters138

Chassis Dimensions3

3x3.5"+2x2.5" cable SAS/SATA config: Xa 125.0mm (4.92"), Xb 132.52mm (5.21"), Ya 329.5mm (12.97"), Yb 332.5mm (13.09"), Za with bezel 5mm (0.19"), Zb 403.8mm (15.89"), Zc 420.55mm (16.55")14x3.5" system: Xa 175mm (6.88"), Ya 360mm (14.17"), Yb 362.9mm (14.28"), Za with bezel 35mm (17"), Zb 400mm (15.74"), Zc 418.75mm (16.48")1Xa 218mm (8.58"), Xb 307.9mm (12.12"), Ya 430.3mm (16.94"), Yb 443.3mm (17.45"), Yc 471.3mm (18.56"), Zb 545.4mm (21.47"), Zc 589.1mm (23.19")1

Chassis Dimensions (24x2.5" / 8x3.5"+8x2.5" NVMe)1

A 446.0mm (17.60"), B 464.0mm (18.27"), C 200.0mm (7.87"), D 663.5mm (26.12"), E with bezel 680.5mm (26.79")1

Chassis Dimensions (4x3.5" / 8x3.5")1

Xa 175mm (6.88"), Ya 369.5mm (14.54"), Yb 382.5mm (15.05"), Za with bezel 19mm (0.74"), Zb 560.5mm (22.06"), Zc 562.12mm (22.13")1

Chassis Dimensions — 12x3.5"1

Xa 200.0mm (7.87"), Xb 293.0mm (11.53"), Ya 446.0mm (17.55"), Yb 464.0mm (18.26"), Yc 508.8mm (20.03"), Za with bezel 17.6mm (0.69"), Zb 660.6mm (26.00"), Zc 695.5mm (27.38")1

Chassis Dimensions — 6x3.5"+2x2.5" NVMe1

Same as above: Xa 175.0mm (6.89"), Ya 369.5mm (14.55"), Yb 382.5mm (15.06"), Zb 560.5mm (22.07"), Zc 562.12mm (22.13")1

Chassis Dimensions — 8x3.5" SAS/SATA1

Xa 175.0mm (6.89"), Ya 369.5mm (14.55"), Yb 382.5mm (15.06"), Za with bezel 19mm (0.75"), Zb 560.5mm (22.07"), Zc 562.12mm (22.13")1

Chassis Options2

8 SFF chassis (upgradable to 16 or 24 SFF with additional cage kits); 4 LFF chassis (upgradable to 12 LFF); 4 LFF non-hot-plug chassis; mixed LFF and SFF drive cages supported within the same server for tiered storage18 SFF chassis with optional tri-mode SFF cage kits, x4 NVMe SFF cage kit, 12 EDSFF cage kit, internal LTO tape drive and slim-line DVD bay; 4 LFF chassis with optional LFF or SFF cage kits, internal LTO tape drive and slim-line DVD bay1

Chassis Weight1

4x3.5" drive system: 23.9kg (52.69lb); 8x3.5" drive system: 29.5kg (65.03lb); 16x2.5" drive system: 27.7kg (61.06lb)1

Chipset1

Intel C620 series — PCIe Gen3, integrated SATA/USB 3.0/10-1Gb Ethernet, Intel Rapid Storage Technology Enterprise, Intel Trusted Execution Technology1

Cooling1

Active fan solution1

Cooling Fans8

1 system cooling fan11 system cooling fan (rear) + 1 processor cooling fan (heat sink)1Up to 1 Standard (STD) and 1 High-Performance PCIe (HPR) cooling fan1Up to 1 Standard (STD) and 1 optional High Performance (HPR) or Standard (STD) cooling fan1Up to 1 cabled fan connected to system board1

Default Smart Chassis1

30C system inlet ambient temperature configuration, one 8 SFF x1 tri-mode drive cage, and MR408i-o controller1

Dimensions1

Height 17.42" (442.70mm), width 6.79" (172.60mm), depth 18.30" (465.00mm)1

Dimensions (as published by Dell)1

Height rear 17.08" (434.00mm), height front 18.97" (482.00mm), width 28.93" (735.00mm), depth 30.44" (772.13mm)1

Drive Bays3

8 bays (4 front, 4 rear) in the optical drive configuration, or 10 bays (6 front, 4 rear) without the optical drive; compatible with SATA, SAS and NVMe18x front-accessible, lockable 2.5" or 3.5" SAS, SATA or NVMe drives1Up to 8x 3.5" SAS/SATA (max 128TB) or up to 16x 2.5" SAS/SATA (max 61TB); chassis available in 4/8/16 drive configurations1

Drive Capacity2

4 to 12 LFF SAS/SATA, 8 to 24 SFF SAS/SATA or NVMe, or up to 12 EDSFF E3.S NVMe SSDs depending on model; mixed SFF and LFF drive cages supported with the LFF chassis, up to three drive cages; internal LTO tape drive supported up to 11Up to 24 SFF, 12 LFF or 12 EDSFF drives; up to three front drive cages that can be mixed, combining dual-mode LFF and tri-mode SFF cages for hybrid storage1

Drive Configuration Options2

Up to 12x 3.5" SAS/SATA HDD; up to 8x 3.5" SAS/SATA HDD; up to 8x 3.5" SAS/SATA + 8x 2.5" NVMe SSD; up to 8x 2.5" SAS/SATA HDD; up to 16x 2.5" SAS/SATA HDD; up to 24x 2.5" SAS/SATA HDD1Up to 4x 3.5" SATA; up to 8x 3.5" SAS/SATA; up to 8x 2.5" SAS/SATA (via 3.5"-to-2.5" adapter); up to 6x 3.5" SAS/SATA + 2x 2.5" direct-attach NVMe; up to 6x 2.5" SAS/SATA (adapter) + 2x 2.5" direct-attach NVMe1

Drive Configuration — Option A1

8x 3.5" or 8x 2.5" (in 3.5" carrier) SAS/SATA/SSD drives1

Drive Configuration — Option B1

18x 3.5" SAS/SATA/SSD drives1

Drive Configuration — Option C1

16x 2.5" SAS/SATA/SSD drives1

Drive Configuration — Option D1

16x 2.5" SAS/SATA/SSD drives with 8x NVMe drives1

Drive Configuration — Option E1

32x 2.5" SAS/SATA/SSD drives1

Drive Configurations1

Up to 8x/16x/24x 2.5" SAS/SATA HDD; up to 8x 3.5" SAS/SATA HDD/SSD; up to 8x 3.5" SAS/SATA + 8x 2.5" NVMe HDD/SSD1

Drive Support3

4x 3.5" cabled SAS/SATA HDD/SSD drives (PERC card required for drives ≥8TB)14x or 8x 3.5" hot-swappable SAS/SATA drives; supports 2.5" drive in 3.5" hybrid drive carrier1Up to 3x 3.5" cable SATA (chipset) or SAS/SATA (PERC); optionally + 2x 2.5" direct-attach NVMe1

Drives1

Up to 4x or 8x 3.5" SAS/SATA drives (2.5" hotplug drives supported in 3.5" carriers for SAS/SATA SSD)1

EDSFF1

Up to 1 drive cage with direct attach cable kit for 12 EDSFF NVMe drives; dual processor configuration required, along with the Redundant Fan Kit and Second CPU Fan Kit1

Embedded Management4

HPE iLO 5, Intelligent Provisioning, HPE InfoSight cloud-based predictive analytics; Server Configuration Lock, iLO Security Dashboard and One Button Secure Erase1HPE iLO 6; HPE Compute Ops Management; HPE OneView1HPE iLO 7 with patented secure enclave technology, redesigned GUI and Redfish API; HPE Compute Ops Management; HPE OneView1iDRAC9 with Lifecycle Controller (Basic, Express, or Enterprise license); agent-free deployment, update, monitoring, and maintenance1

Environmental — ASHRAE1

For additional details, see Product Environmental Datasheet (not included in this excerpt)1

Environmental — ASHRAE A21

10-35°C (50-95°F) at ≤900m altitude, 8-80% RH non-condensing, 1°C/300m de-rating above 900m5

Environmental — ASHRAE A32

5-40°C (41-104°F) at ≤900m altitude, 8-85% RH non-condensing, 1°C/175m de-rating above 900m35-40°C (41-104°F) at ≤900m altitude, 8-80% RH non-condensing, 1°C/175m de-rating above 900m1

Environmental — ASHRAE A42

5-45°C (41-113°F) at ≤900m altitude, 8-90% RH non-condensing, 1°C/125m de-rating above 900m45-45°C (41-113°F) at ≤900m altitude, 8-80% RH non-condensing, 1°C/125m de-rating above 900m; certain configs require operating temp <28°C1

Environmental — Altitude1

Operating: 3048m (10,000ft) max; Storage: 12,000m (39,370ft) max1

Environmental — Humidity1

Storage: 5-95% RH, 33°C max dew point; Operating: 10-80% RH, 29°C max dew point1

Environmental — Rugged1

5-55°C (41-131°F) at ≤900m altitude, 8-90% RH non-condensing, 1°C/125m de-rating above 900m2

Environmental — Temperature1

Storage: -40 to 65°C (-40 to 149°F); Continuous operation: 10-35°C (50-95°F), no direct sunlight, altitude under 950m; expanded range 5-40°C continuous, -5 to 45°C for ≤1% annual hours1

Environmental — Vibration/Shock1

Operating vibration 0.26Grms (5-350Hz); Storage vibration 1.88Grms (10-500Hz); Operating shock 6G/11ms; Storage shock 71G/2ms1

Expanded Operating Temperature Restrictions1

Two redundant PSUs required for expanded range; no cooling redundancy (single fan); supports up to 80W processor; GPU not supported; tape backup supported1

Expansion Card Slots4

Up to 2 PCIe Gen4 + 2 PCIe Gen3: Slot 1 (Gen4, x4 in x8, Processor 1), Slot 2 (Gen4, x16, Processor 1), Slot 3 (Gen3, x1, PCH), Slot 4 (Gen3, x4 in x8, PCH); Slot 1 disabled when using Intel Pentium processor1Up to 2 PCIe Gen4 + 2 PCIe Gen3: Slot 1 (Gen4, x4 in x8, Processor), Slot 2 (Gen4, x16 in x16, Processor), Slot 3 (Gen3, x1, PCH), Slot 4 (Gen3, x4 in x8, PCH); Slot 1 does not function when Pentium processor is installed1Up to 2 PCIe slots: Slot 1 (Gen4, Half Height/Half Length, x4 electrical/x8 mechanical), Slot 2 (Gen4, Half Height/Half Length, x16 electrical/x16 mechanical)1Up to 4 PCIe slots (3 Gen4, 1 Gen5): Slot 1 (Gen4, x4, Processor 1), Slot 2 (Gen5, x16, Processor 1), Slot 3 (Gen4, x1, PCH), Slot 4 (Gen4, x4, PCH)1

Expansion Options1

Optional Thunderbolt 4.0 card, additional network controllers, and PCIe storage expansion cards1

Expansion Slots4

9 PCIe Gen3 expansion cards, including a dedicated PERC slot1Up to 4 PCIe Gen3: Slot 1 (x8 in x8, Processor), Slot 2 (x8 in x16, Processor), Slot 3 (x1, PCH), Slot 4 (x4 in x8, PCH); not hot-swappable1Up to 4 PCIe x16 slots (3 at x16 lanes, 1 at x8 lanes on Gen4) plus 2 Gen5 x16 GPU riser slots; Slot 1/2 are GPU risers (Processor 2/Processor 1), Slots 3-6 are standard expansion1Up to 6 PCIe Gen4 expansion cards: Slot 1 (x16, Processor 1), Slot 2 (x16, Processor 2), Slot 3 (x16, Processor 2), Slot 4 (x16, Processor 2), Slot 5 (x8, PCH), Slot 6 (x16, Processor 1)1

Fans3

2 standard non-hot-plug fans; optional 4 additional hot-plug fans with N+1 redundancy. A redundant fan cage kit is required for dual-processor configurations and for field upgrade to 24 SFF1Air cooling with standard fans; optional 8-fan configuration providing N+1 redundancy for heavier configurations1Base models ship with 3 standard non-hot-plug fans; performance models typically ship with 8 fans providing N+1 redundancy. Optional Redundant Fan Kit, Second CPU Fan Kit and External GPU Fan Kit provide advanced cooling for heavier configurations1

GPU Riser Configuration1

Slots 1 and 2 support x16 PCIe GPU risers; PERC and rear storage not supported on GPU riser slots1

GPU Support11

1x 60W single-width GPU; systems with GPU have higher fan acoustics, not recommended for acoustic-sensitive environments11x DW 300W GPU supported at 150W (1x NVIDIA NVS 310 or 1x NVIDIA Quadro P4000 referenced); see Dell.com/GPU for latest compatibility1NVIDIA RTX 4000 Ada Graphics Accelerator, NVIDIA L40 48GB Accelerator, NVIDIA A16 64GB Accelerator, NVIDIA L4 24GB Accelerator1NVIDIA RTX PRO 4500 Blackwell Server Edition 32GB and NVIDIA RTX A1000 8GB1Up to 2x 300W double-wide professional graphics cards in PCIe Gen5 slots from NVIDIA or AMD. Note: dual processors and a 1400W or 2400W power supply are required1

GPU Thermal Note1

GPGPU configurations are not supported at ambient temperatures of 35°C or above1

Hot Spare Feature1

Redundant PSU switches to sleep state under low load to maximize efficiency; active PSU handles 100% of load; automatically reactivates if voltage drops or load exceeds 50% of rated wattage1

I/O & Ports1

2x 1GbE LOM, 1 dedicated iDRAC port, 9x USB (5x USB 2.0, 4x USB 3.0 including 1 internal), 1 VGA port, 1 serial port, up to 5 PCIe Gen3 slots1

IDSDM (Optional)1

Internal Dual SD Module supporting 2 SD cards; capacities 16GB/32GB/64GB; one slot dedicated for redundancy1

IDSDM Module1

Optional; supports 3 microSD cards (2 for IDSDM, 1 for vFlash); IDSDM capacities 16/32/64GB, vFlash capacity 16GB1

IDSDM/vFlash1

vFlash only, IDSDM only, or vFlash+IDSDM; microSD capacities 16/32/64GB (IDSDM), 16GB (vFlash); requires iDRAC Enterprise license for IDSDM-only1

Integrated Graphics1

None. A discrete graphics card is required for display output1

Internal Boot2

HPE NS204i-u v2 RAID1 M.2 NVMe boot device1Hot-pluggable, high-availability RAID1-protected M.2 NVMe boot option1

M.2 Storage1

Up to 8x M.2 NVMe drives (4 front, 4 rear) in quick-release FlexBay sleds, accessible without opening the chassis1

Management2

Dell Optimizer for Precision1iDRAC9 with Quick Sync 2.0 support1

Maximum Altitude1

Operating 3048m (10,000ft); Storage 12,000m (39,370ft)1

Maximum Storage2

Up to 152TB1Up to 240TB in LFF configuration using 20TB LFF SATA/SAS HDDs1

Media Bays1

Half-height (5.25") media bay options and slim-line optical drive bay; internal LTO tape drive supported1

Memory Population1

Max 2 DIMM types per system, max 2 DIMM capacities, max 2 DIMM ranks; RDIMM and LRDIMM cannot be mixed1

Memory RAS Features1

Dense configuration optimized profile, demand/patrol scrubbing, SDDC recovery, failed DIMM isolation, memory mirroring, address parity protection, memory sparing, thermal throttling1

Memory Slots2

16x 288-pin sockets, speeds 3200 MT/s / 2933 MT/s124 DIMM slots (12 per processor, 6 memory channels per processor), or up to 12 NVDIMM-N (1 per channel)1

Memory Speeds — LRDIMM1

1 DIMM/channel: 2933/2666/2400/2133 MT/s, quad or octo rank; 2 DIMM/channel: 2666/2400/2133 MT/s, quad or octo rank1

Memory Speeds — RDIMM1

1 DIMM/channel: 2933/2666/2400/2133 MT/s, dual or single rank; 2 DIMM/channel: same speeds, dual or single rank1

Memory Types Supported1

DDR4 RDIMM, LRDIMM, NVDIMM-N; NVDIMM-N and RDIMM must not be mixed with LRDIMM1

Memory Voltage1

1.2V1

Memory — 4th Gen Xeon1

DDR5 RDIMM: 16GB/32GB/64GB single or dual rank; single processor up to 512GB, dual processor up to 1TB; 16x 288-pin sockets at 4000/4400/4800 MT/s1

Memory — 5th Gen Xeon1

DDR5 RDIMM: 16GB/32GB/64GB/96GB single or dual rank; single processor up to 768GB, dual processor up to 1.5TB; 16x 288-pin sockets at 4000/4400/4800/5200/5600 MT/s1

NIC Ports6

2x 10/100/1000 Mbps embedded on LOM (2x 1GbE); optional Network Card options: 1GbE x4, 10GbE x2, 10GbE x422x 10/100/1000 Mbps embedded on LOM, plus 1x OCP x8 3.0 optional card1LOM: 2x 1GbE; Optional OCP 3.0 card: 1GbE x4, 10GbE x2, 25GbE x2, 25GbE x4, 50GbE x2, or 100GbE x21Up to 2x 10/100/1000 Mbps NIC ports (rear panel)1Up to 2x 10/100/1000 Mbps embedded on motherboard (1GbE x2)1

NVMe2

Up to 24 NVMe drives with PCIe Gen5 x2 bandwidth. With the x4 direct attach cable kit, up to 2 drive cages for 16 NVMe drives; with the x2 direct attach cable kit, up to 3 drive cages for 24 NVMe drives. Mixing x2 and x4 cable kits is not allowed1Up to 8 SFF NVMe SSDs via the SFF NVMe Express Bay option; requires two ML350 Gen10 NVMe riser boards1

NVMe and EDSFF1

U.3 x4 NVMe 8SFF and 12 EDSFF drive cage kits are supported with the SFF CTO server only, up to one drive cage1

Non-Operational Limits2

Temperature -40 to 65°C (-40 to 149°F); Humidity 5-95% RH, 27°C max dew point; Max altitude 12,000m (39,370ft) storage, 3,048m (10,000ft) operational3Temperature -40 to 65°C (-104 to 149°F); Humidity 5-95% RH, 27°C max dew point; Max altitude 12,000m (39,370ft) storage, 3,048m (10,000ft) operational2

Operating Systems3

Windows 11 Pro, Ubuntu 22.04 LTS 64-bit, Ubuntu 20.04 LTS 64-bit, Red Hat Enterprise Linux 9.31Windows 11 Pro, Windows 11 Pro for Workstations, Windows 10, Ubuntu 22.04 LTS 64-bit, Red Hat Enterprise Linux 8.61Windows 11 for Workstations, Ubuntu 24.04 64-bit, Red Hat Enterprise Linux 9.31

Optical Drive5

1x Slim SATA DVD-ROM or DVD+/-RW drive (data only)21x Slim SATA DVD-ROM drive (data only)11x dedicated SATA DVD-ROM or DVD+/-RW drive1DVD-ROM or DVD+/-RW1Optional1

Optical and Media1

Optional slim optical drive and front-panel SD card slot1

Optical/Tape Drive Support1

Varies by drive config: up to 2x SATA slim optical + 1x SAS tape drive (8x3.5"/16x2.5" configs), down to 1x SATA slim optical only on max-density 32-drive configs1

PCIe CNA Options1

QLogic QLE8152, Emulex OCE10102FM/OCE10102IM, Broadcom 57711, Intel DT — FCoE/iSCSI support1

PCIe Expansion Slots1

5 slots total: Slot 1 (x4, Full height/Half length), Slot 2 (x4), Slot 3 (x16, Full length), Slot 4 (x8), Slot 5 (x8)1

PCIe HBA Options1

QLogic QLE2462/2460/2562/2560, Emulex LPe-1150/11002/12000/12002 Fiber Channel HBAs1

PCIe NIC Options1

Intel PRO/1000 PT/VT, Intel 10GBase-T, Broadcom BMC57710/BMC5709C/NetXtreme II 57711, Intel Gigabit ET Dual/Quad Port1

PCIe Slots5

5 PCIe expansion slots16 rear-accessible PCIe slots — 2 at PCIe Gen5 and 4 at PCIe Gen418 PCIe 3.0 slots in the 2P model, accessible from the rear1Default 4x x8 PCIe 5.0 slots with the primary riser cage, upgradable with an additional riser kit; up to 10 standard PCIe Gen5 slots plus 2 OCP 3.0 slots. Dual processors are required to support expansion cards in PCIe slots 5 to 101Up to 4x x16 PCIe Gen5 slots plus 2x x16 OCP 3.0 slots1

PSU Derating Notes1

1400W/1100W AC PSUs derate to 1050W at low line 100-120VAC; 2400W AC PSUs derate to 1400W at low line 100-120VAC1

PSU Detail1

1100W AC Platinum (4100 BTU/hr), 750W AC Platinum (2891 BTU/hr), 495W AC Platinum (1908 BTU/hr), 450W AC Bronze (7871 BTU/hr); 1100W PSUs derate to 1050W at low line 100-120Vac1

PSU Notes2

Both PSUs must have matching label type (e.g. EPP); mixing PSUs from previous generations not supported; Titanium PSU rated for 200-240V AC only1IT power systems phase-to-phase voltage not exceeding 240V; 1400W/1100W AC PSUs derate to 1050W at low line 100-120VAC1

PSU Options1

495W AC Platinum (1908 BTU/hr, 6.5-3A) or 350W AC Bronze (1455 BTU/hr, 5.5-3A); supports up to 2 AC PSUs1

PSU Power Cord2

Cable PSU 106mm (450W AC) or Redundant 60mm (600W/700W AC), C13/C14 connector1Cable PSU 120mm, C13/C14 connector, supports both 300W and 500W AC output1

PSU Power Cords1

Redundant 60mm form factor: C13 (600W-1100W mixed mode); LOTES APOW0097 (1100W -48VDC); APP 2006G1 (1400W 277Vac/HVDC); C15 (1800W HLAC); Redundant 86mm: C19 (2400W), C21 (2800W HLAC)1

Particulate Contamination3

Data center air filtration per ISO Class 8 (ISO 14644-1, 95% confidence); MERV11/MERV13 filtration required at data center intake; air must be free of conductive/corrosive dust2Data center air filtration per ISO Class 8 (ISO 14644-1, 95% confidence); MERV11/MERV13 filtration required; air must be free of conductive/corrosive dust; Copper corrosion <300Å/month, Silver corrosion <200Å/month2ISO Class 8 air filtration (data center); MERV11/MERV13 filtration required; air free of conductive/corrosive dust; Copper corrosion <300Å/month, Silver corrosion <200Å/month1

Particulate/Gaseous Contamination1

ISO Class 8 air filtration (data center); Copper coupon corrosion <300Å/month; Silver coupon corrosion <200Å/month1

Ports1

2x RJ-45, dedicated iDRAC9 network connector, USB 2.0, USB 3.0 Gen 1, VGA port, system ID button1

Ports — Front3

1x USB 3.0, 1x iDRAC Direct (Micro-AB USB 2.0)21x USB 3.2 Gen1, 1x iDRAC Direct (Micro-AB USB)21x USB 2.0, 1x USB 3.0, 1x iDRAC Direct (Micro-AB USB)1

Ports — Internal2

1x USB 3.2 Gen121x Internal USB 3.01

Ports — Internal (Optional)1

1x Internal USB 3.02

Ports — Rear3

3x USB 2.0, 3x USB 3.2 Gen125x USB 2.0, 1x USB 3.021x Dedicated iDRAC (RJ45), 1x USB 2.0, 1x USB 3.0, 1x DB-15 VGA1

Power Supplies8

1000W Platinum or 1350W Platinum internal power supply1495W/750W/1100W hot-plug Gold or Platinum efficiency, or 450W cabled AC PSU; up to 2 hot-swappable AC PSUs with 1+1 redundancy, auto-sensing, auto-switching1750W Platinum standard, or optional 1350W Platinum1800W, 1100W, 1400W or 2400W hot-swap redundant internal power supplies1HPE Flex Slot hot-plug power supplies including 800W Platinum and 1000W Titanium options, redundant1

Power Supply4

1 AC cabled PSU: 300W Bronze (1024 BTU/hr, 4.6A) or 400W Platinum (1365 BTU/hr, 5.4A), 100-240V AC autoranging11 AC cabled PSU: 300W Bronze (1250 BTU/hr, 4.6-2.3A) or 500W Platinum (1920 BTU/hr, 7.0-3.5A); IT power systems phase-to-phase voltage not exceeding 240V1Up to 1 cabled or 2 redundant AC PSUs: 450W Bronze (1871 BTU/hr, 6.5-3.5A), 600W Platinum (2250 BTU/hr, 7.1-3.6A), or 600W Mixed Mode HVDC (240V, 2.9A)1Up to 2 AC or DC PSUs: 450W Platinum (1730 BTU/hr, 6.5-3.5A), 600W Platinum (2250 BTU/hr, 7.1-3.6A) or 600W DC Mixed Mode, 700W Titanium (2625 BTU/hr, 4.1A) or 700W DC Mixed Mode (3.4A)1

Power Supply Options2

600W-2800W range, Platinum/Titanium efficiency, AC/DC/mixed-mode/HLAC variants; e.g. 600W Platinum (2250 BTU/hr), 1100W Titanium (4125 BTU/hr), 1400W Platinum/Titanium (5250 BTU/hr), 1800W Titanium HLAC (6610 BTU/hr), 2400W Platinum (9000 BTU/hr), 2800W Titanium HLAC (10500 BTU/hr)1Up to 2 PSUs: 600W Mixed Mode Platinum (2250 BTU/hr), 800W Mixed Mode Platinum (3000 BTU/hr), 1100W DC (4265 BTU/hr, -48 to -60VDC), 1100W Mixed Mode Titanium (4125 BTU/hr), 1400W Mixed Mode Platinum (5250 BTU/hr), 2400W Mixed Mode Platinum (9000 BTU/hr), 700W Mixed Mode Titanium (2625 BTU/hr, 200-240VAC only), 1800W Mixed Mode Titanium (6000 BTU/hr, 200-240VAC only)1

Processor11

3rd Generation Intel Xeon Scalable processors with up to 32 cores; up to two supported1One AMD Ryzen Threadripper PRO 7000 WX-Series processor, 350W TDP. Options include 7945WX (12 cores/24 threads), 7955WX (16/32), 7965WX (24/48), 7975WX (32/64), 7985WX (64/128) and 7995WX (96 cores/192 threads)1One Intel Xeon W-2400 series processor from the w3, w5 or w7 tiers, 6 to 24 cores and up to 48 threads, up to 225W TDP. Options include w3-2423 (6 cores), w3-2425 (6), w3-2435 (8), w5-2445 (10), w5-2455X (12), w5-2465X (16), w7-2475X (20) and w7-2495X (24 cores)1One Intel Xeon W-3400 series processor, up to 56 cores and 112 threads, up to 350W TDP1One or two 1st or 2nd Generation Intel Xeon Scalable processors (Bronze, Silver, Gold, Platinum), 4 to 28 cores, 85W to 205W. Note: field upgrade from 1st Generation to 2nd Generation processors is not supported, and mixing two different processor models is not supported1

Processor Features1

Up to 16 cores with Intel HT Technology, Intel Turbo Boost (excludes Bronze), 85-105W TDP, Socket P, 14nm process, Intel UPI up to 10.4GT/s, 6 channels DDR4 per CPU, up to 48 PCIe lanes per CPU1

RAID2

MegaRAID 9660-16i and MegaRAID 9540-8i controller card options1PERC H755 front SAS hardware RAID controller1

Rack Kit1

Optional sliding rack kit1

Rack Rails1

Optional sliding rail supports square/unthreaded round and threaded hole racks via ReadyRails II; tool-less with optional tooled conversion; optional cable management arm (CMA)1

Recommended Support1

Dell EMC ProSupport Plus (business-critical, proactive/predictive) or ProSupport (24x7x365, hypervisor/OS support, next-business-day or 4-hour mission-critical onsite response)1

Relative Humidity — Operating1

10-80% RH, 29°C (84.2°F) max dew point1

Relative Humidity — Storage1

5-95% RH, 33°C (91°F) max dew point, non-condensing1

Remote Access Options1

Teradici PCoIP dual and quad display remote workstation cards; Amulet Hotkey dual and quad display zero clients1

Remote Management2

iDRAC9 (vs. iDRAC8 on predecessor T430); dedicated RJ45 iDRAC port1iDRAC9 Express or iDRAC9 Enterprise licences; Dell Optimizer for Precision1

Security6

TPM 2.0, lockable chassis with intrusion detection, self-encrypting drive support3HPE Silicon Root of Trust anchored to an HPE-exclusive ASIC, binding firmware to a processor-specific fingerprint that must match before boot; UEFI Secure Boot; TPM 2.0; intrusion detection; optional lockable bezel; Intel SGX and TDX isolation. iLO 7 supports quantum-resistant (PQC) algorithms and signs Gen12 firmware with CNSA 2.0-approved algorithms1HPE Silicon Root of Trust anchored to an HPE-exclusive ASIC, binding firmware to a processor-specific fingerprint that must match before boot; UEFI Secure Boot; TPM; secure firmware updates and Secure Recovery1HPE Silicon Root of Trust with firmware validated at start-up, Secure Recovery to restore critical firmware to a known good state, standard security front bezel1TPM 1.2/2.0 optional, cryptographically signed firmware, Silicon Root of Trust, Secure Boot, System Lockdown (requires iDRAC Enterprise/Datacenter), System Erase, secure supply chain1

Security Features — Physical1

Tooled cover latch, optional lockable metal bezel, BIOS power-off security (disable power button)1

Serial Connector4

1x DTE 16550-compliant serial port on system board (optional card installs like expansion filler bracket)31x 9-pin DTE 16550-compliant serial connector (rear panel)21x 9-pin DTE 16550-compliant serial connector11x optional card-type 9-pin DTE 16550-compliant connector (installs like expansion card filler bracket)1

Serviceability2

Front-accessible boot storage and expansion slots designed for tool-less access1Tool-less interior with colour-coded components; front and side service access1

Shock1

Operating: 6G for up to 11ms (6 pulses, x/y/z axes); Storage: 71G for up to 2ms (6 pulses, one per side)5

Sizing1

Form factor: Tower or rack, 5U; Chassis max depth 594.82mm1

Standards Compliance1

ACPI v2.0c, Ethernet IEEE 802.3-2005, IPMI v2.0, DDR4 SDRAM, PCI Express Rev 2.0/3.0, SAS v1.1, SATA Rev 2.6, SMBIOS v2.7, TPM v1.2/2.0, UEFI v2.1, USB Rev 2.01

Storage2

2x internal 3.5" drive bays, 2x onboard M.2 slots, and 2x front FlexBays accepting additional NVMe or SATA devices; expandable via Dell Ultra-Speed Drive Quad and Duo PCIe cards; maximum capacity up to 56TB12x internal SATA 2.5" or 3.5" drives with 2x M.2 PCIe NVMe Gen4 SSDs, or 2x external SATA 2.5" or 3.5" FlexBays with 2x M.2 PCIe NVMe Gen4 FlexBays; up to 8x 4TB M.2 NVMe drives via PCIe storage cards; maximum capacity up to 56TB1

Storage Controllers11

HPE MR408i-o Gen11 OCP storage controller and other Gen11 controller options; MR408i-o supports up to 8 SAS/SATA/NVMe drives with performance RAID and occupies OCP slot 141HPE MR408i-o Gen11 x8 lanes 4GB cache OCP SPDM storage controller included in the default Smart chassis configuration1HPE Smart Array S100i and HPE Smart Array P408i; broad range of Smart Array and HBA options1Internal: HBA465i fPERC, HBA355i fPERC, H355 fPERC, H755 fPERC, H755N fPERC, H965i fPERC; External: HBA355e; Internal Boot: BOSS-N1 (HWRAID 0/1, 2x M.2 NVMe); Software RAID: S160; SAS HBA: 22.5Gbps SAS Ext. HBA1Internal: PERC H345, PERC H355, PERC H755, HBA355i, S150; External: HBA355e1

Supported Drives — SAS/SATA HDD1

2.5": 1TB-2TB (7.2K), 600GB-2.4TB (10K), 300GB-900GB (15K); 3.5": 1TB-16TB SATA, 2TB-16TB SAS (7.2K), FIPS SED options available1

Supported Drives — SAS/SATA SSD1

2.5": 120GB-7680GB SATA SSD, 400GB-3840GB SAS SSD1

Supported Operating Systems6

Canonical Ubuntu Server LTS, Microsoft Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi3Canonical Ubuntu LTS, Citrix Hypervisor, Microsoft Windows Server LTSC with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi1Canonical Ubuntu LTS, Citrix Hypervisor, Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi1Canonical Ubuntu Server LTS, Citrix Hypervisor, Microsoft Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi1Canonical Ubuntu Server LTS, VMware ESXi, Microsoft Windows Server with Hyper-V, Red Hat Enterprise Linux, SUSE Linux Enterprise Server1

Supported Processors4

Intel Xeon 6300 series, Intel Xeon E-2400 series, or Intel Pentium G7400/G7400T — 1 processor supported (Note: Xeon 6300 series does not support Windows Server 2019)2Intel Xeon E-2200 product family, Intel Core i3 9100, Intel Pentium G5420, Intel Celeron G4930, Intel Xeon E-2100 product family, Intel Core i3 8100, Intel Pentium G5500, Intel Celeron G4900 — 1 processor supported1Intel Xeon E-2300 Series (up to 8 cores) or Intel Pentium (up to 2 cores) — 1 processor supported1Intel Xeon E-2300 series (up to 8 cores) or Intel Pentium processor (up to 2 cores per processor) — 1 processor supported (Pentium max memory speed 2666 MT/s)1

System Battery2

1x CR 2032 3.0V lithium coin cell6CR 2032 3.0V lithium coin cell1

System Dimensions1

Xa 307.9mm (12.12"), Xb 218mm (8.58"), Ya 430.3mm (16.94"), Yb 464.362mm (18.28"), Yc 471.333mm (17.37"), Zb 538.4mm (21.19"), Zc 573.636mm (22.58")1

System Weight7

12x3.5": 48kg (107.32lb); 8x3.5": 43.16kg (95.15lb); 8x3.5"+8x2.5"NVMe: 46.84kg (103.26lb); 8x2.5": 39.40kg (86.86lb); 16x2.5": 42.02kg (92.63lb); 24x2.5": 44.64kg (98.41lb)14x3.5" config: 19.54kg (43.07lb); 8x3.5" config: 25.34kg (55.86lb)14x3.5" system, maximum with all drives/SSDs: 11.68kg (25.74lb)18x3.5"+8x2.5" NVMe: 44.48kg (98.06lb); 24x2.5" SAS/SATA: 44.1kg (97.22lb)1Fully populated with drives: 11.64kg (25.66lb); Without drives/PSU: 6.31kg (13.91lb)1

Tape Drives1

Up to 2x dedicated 5.25" tape drives1

Target Workloads7

Advanced graphics, 3D animation, CAD and CAM applications, AI development and AI deployment1Big data analysis, rendering and simulation, AI model development, CAD/CAE, and secured remote compute environments1Generative AI and machine learning development, professional visualisation, rendering, simulation, CAD/CAE and molecular dynamics1IT infrastructure, data management, VDI, ERP/CRM, virtualisation and mixed on-premises workloads1IT infrastructure, data management, VDI, ERP/CRM, virtualisation, databases, backup infrastructure and selected GPU-accelerated workloads1

Temperature — Continuous Operation1

10-35°C (50-95°F), no direct sunlight, altitude under 950m/3117ft1

Temperature — Storage1

-40 to 65°C (-40 to 149°F)1

Thermal Air Restrictions1

Two PSUs required for redundant mode (PSU failure not supported in redundant mode); non-Dell qualified or >25W peripheral cards not supported; GPU not supported; 950m max altitude for fresh air cooling; single fan means no cooling redundancy; DIMM blank not required1

Thermal Restriction1

3.5" drive count restricted to 2 drives per chassis under ASHRAE A4 conditions; DIMM blank not required1

Thermal Restrictions — 2.5" Configs1

4x STD fans support only CPU TDP≤185W; ASHRAE A3: 8x STD fans not supported with CPU TDP>120W, TBU not supported; ASHRAE A4: STD not supported, 4x HPR fans not supported with CPU TDP>165W, BOSS M.2 not supported1

Thermal Restrictions — 8x3.5"1

STD fans (3x/4x) support only CPU TDP≤185W; ASHRAE A3: 6x/8x STD fans not supported with CPU TDP>120W, TBU not supported; ASHRAE A4: STD fans not supported entirely, HPR fans (3x/4x) not supported with CPU TDP>165W, TBU not supported1

Thermal Restrictions — NVMe Hybrid1

HPR fans required at standard operation; two PSUs required across all ASHRAE tiers (system performance may reduce on PSU failure); non-Dell qualified peripheral/Channel FW cards not supported; NIC power ≥25W not supported1

USB Ports2

Front: 1x USB 2.0, 1x USB 3.0; Rear: 1x USB 3.0, 1x USB 2.0, 1x iDRAC Direct (Micro-AB USB 2.0)1Front: 1x USB 3.0, 1x iDRAC USB MGMT (USB 2.0); Rear: 2x USB 3.0, 4x USB 2.0; Internal: 1x USB 3.01

USB Ports (Front)1

1x USB 2.0-compliant, 1x USB 3.0-compliant1

USB Ports (Rear)1

4x USB 2.0-compliant, 2x USB 3.0-compliant1

VGA Port3

1x 15-pin VGA port (rear panel)11x DB-15 VGA port (back panel)11x DB-15 VGA port (rear panel)1

VGA Ports1

1x DB-15 VGA port each on front and back panels1

Vibration3

Operating: 0.21G rms at 5-500Hz for 10 min (all axes); Storage: 1.88G rms at 10-500Hz for 15 min (all six sides tested)2Operating: 0.26G rms at 5-350Hz (all orientations); Storage: 1.88G rms at 10-500Hz for 15 min (all six sides tested)2Operating: 0.21G rms at 5-500Hz (all orientations); Storage: 1.88G rms at 10-500Hz for 15 min (all six sides tested)1

Video4

Integrated Matrox G200 graphics controller, 16MB video frame buffer, resolutions up to 1920x1200 at 8/16/32-bit color depth4Integrated Matrox G200eW graphics controller, 16MB video frame buffer, resolutions up to 1920x1200 at 32-bit color depth2Matrox G200 graphics card with iDRAC9; resolutions up to 1920x1200, rear/front panel VGA and DVO DisplayPort support varies by resolution1Matrox G200eW3 graphics card, 16MB capacity; resolutions up to 1280x1024 at 8/16/24-bit color depth1

Weight2

Minimum 40.39lb (18.34kg); maximum 56.34lb (25.57kg)1Minimum 46.25lb (20.98kg); maximum 65.36lb (29.64kg)1

Wireless2

Qualcomm WCN6856-DBS 2x2 MIMO Wi-Fi 6E (802.11ax) with Bluetooth 5.31Wi-Fi 6E with Bluetooth 5.31